Advantages of Vertical Continuous Plating Line MCP-PAL
  1. Excellent Plating Distribution/Through Hole Plating/Via Filling

  2. Consistent Panel-to-Panel Plating Quality

  3. Capable of Panel, Pattern and other Plating Processes

  4. Can be incorporated with Soluble or Insoluble Anodes

  5. Able to handle Typical Panel Thickness ranges from 0.06mm to 3.2mm

  1. Auto Load/Unload Systems

  2. Auto Cathode Shielding

  3. In-line Rack Strip

  4. Minimal Fume Exhaust

  5. Easy Operation and Maintenance

  6. Less Space Requirement

  7. Lower Operation Costs

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